The iCode HS22X22X10 is a compact passive heat sink engineered for space-constrained computing environments where thermal management is essential but active cooling systems are impractical. At just 22x22x10mm, this cooler delivers reliable thermal dissipation to keep your components operating within safe temperature ranges.
Key Features
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Ultra-compact 22x22x10mm footprint designed for tight installations
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Effective passive cooling performance without fans or active power requirements
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Pre-applied thermal adhesive tape for hassle-free installation—simply peel the protective sticker and press onto your CPU
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Ideal for FPGA development boards, including the DE10-NANO board used with MiSTer systems
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Maintains stable component temperatures during extended operation
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Reliable thermal performance that extends component lifespan
Perfect For
This heat sink is engineered for embedded systems, retro computing platforms, FPGA projects, and any small-form-factor application where conventional cooling solutions won’t fit. Its pre-attached thermal adhesive tape eliminates the need for additional mounting hardware or thermal paste, making installation straightforward and reliable.
Installation is simple: peel back the protective sticker cover and adhere the heat sink directly to your CPU. No tools, thermal paste, or complex mounting brackets required.
